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Effect of CuO solid particles on thermal behavior of multilayer epoxy- based glass fiber composite


In this research work, two types of composites’ specimens are prepared by using CaCO3, Al2O3, MgO, TiO2 and CuO as functional fillers with epoxy as matrix and glass fiber as reinforcement. Initially three composite specimens are fabricated where TiO2 particle of varying wt (4gm, 8gm, 12gm) is used with fixed wt of epoxy and glass fiber (120gm and12gm, 212gm). Similarly another three composites’ specimens are prepared where CuO is used instead of TiO2. In both the cases equal manual compression pressure is used. Thermogravimetric analysis (TGA) and scanning electronic microcopy (SEM) analysis of the prepared specimens are done with the help of calorimetric and Mountains®8 software respectively. Due to addition of TiO2 and CuO it is observed that the melting temperature (Tm) and glass transition temperature (Tg) are elevated which indicate degree of composite crystallinity established by the strong interfacial interactions of CuO than that of TiO2 particles and the amorphous region of the chain. As a result thermal stability of the composites prepared with CuO is enhanced over TiO2. Particle scanning of the composites by Mountains®8 software analysis shows that with increasing projection area and mean diameter of functional filler particles, surface outlines of the composites are smoothen which has positive correlation with CuO particles in the composites.


composite, glass fiber, epoxy, thermal behavior, tga, fillers